Atomistic insights into strain localization at basal twist grain boundaries in hexagonal close-packed metals

· · 来源:dev资讯

公司在近期调研中释放的产品进展,试图为扩产提供支撑:700V高压BCD产品工程阶段取得重大突破,计划2026年释放产能;与芯微泰克合作的1200V背道激光退火超薄片IGBT进入工程批试样。技术突破与扩产规划形成对应,看似具备落地基础,但产能释放与市场需求、客户验证之间的时间差,仍然具备不确定性。

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